The Bonder is a HB16 from the company tpt.
Technical characteristics of the bonder:
The bonder can do both wire- and ribbon-bonding.
Supported bond-types are :
We can work with gold and Aluminium wires.
At the moment a 25 µm Gold-wire and a 33 µm Aluminium wire are available. Supported wire-diameters range from 17 µm to 75 µm and ribbons can have a size of 25 x 250 µm.
With the tools and materials available at the institutes the following densities are possible :
If you need other specifications please contact one of the 3 institutes.