The PMG is able to examine, with the help of an infrared camera (recent microbolometer technology), in addition to the conventional measurement technologies also contactless the heating up behavior of devices, components or system components (for example electric switchboard) quickly and comprehensively.
This can occur in the development phase of the devices to show the location of thermal problems for example (e. g.) the overheating of components. Within the scope of EC type testing the application of the infrared camera provides is an effective and reliable opportunity for the comprehensive, examination efficiently and economically.